Printed wiring board and a method of manufacturing a printed wiring board

ABSTRACT

A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding to the apertures of the solder-resist layer, forming a first bump having a first height, from the solder ball in the small aperture, and a second bump having a second height, from the solder ball in the large aperture, the first height being greater than the second height, and pressing a top of the first bump such that the first height becomes substantially the same as the second height. A multilayer printed wiring board includes a solder-resist layer with apertures of differing sizes and solder bumps having substantially equal volumes but a difference in height no greater than 10 μm.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of PCT/JP2007/051354, filed Jan. 29,2007, which claims priority to Japanese patent application No.2006-019065, filed Jan. 27, 2006, the entire contents of each of whichis incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a printed wiring board which cansuitably be used for a package substrate comprising a build-upmultilayer wiring board for mounting an IC chip and a method ofmanufacturing the printed wiring board.

2. Discussion of the Background

Solder bumps are used for an electrical connection between a packagesubstrate and an IC chip. Solder bumps are formed with the followingsteps.

(1) A step of printing flux on connection pads formed in a packagesubstrate.

(2) A step of loading solder balls on the connection pads with fluxprinted thereon.

(3) A step of forming solder bumps out of solder balls by reflow.

An IC chip is placed on solder bumps after the solder bumps are formedon a package substrate and the solder bumps and the pads (terminals) onthe IC chip are connected by reflow such that the IC chip is mounted onthe package substrate. For the above-described step of loading solderballs on connection pads, the printing technology using concurrently aball arrangement mask and a squeegee is shown in Japanese UnexaminedPatent Application Publication No. 2001-267731, the entire content ofwhich is incorporated herein by reference.

SUMMARY OF THE INVENTION

One aspect of the present invention includes a method of manufacturing aprinted wiring board having bumps. The method includes forming asolder-resist layer having a small-diameter aperture and alarge-diameter aperture, each aperture exposing a respective conductivepad of the printed wiring board, loading a solder ball in each of thesmall-diameter aperture and the large-diameter aperture using a maskwith aperture areas that correspond to the small-diameter aperture andthe large-diameter aperture of the solder-resist layer, forming a firstbump, having a first height, from the solder ball in the small-diameteraperture, and forming a second bump, having a second height, from thesolder ball in the large-diameter aperture, where the first height isgreater than the second height. The method further includes pressing atop of the first bump in the small-diameter aperture such that the firstheight of the first bump becomes substantially the same as the secondheight of the second bump. Another aspect of the invention includes amultilayer printed wiring board including a substrate with a first side,and a second side opposing the first side. The wiring board furtherincludes a laminated structure including alternately laminatedinterlayer resin insulating layers and conductor layers, the laminatedstructure being provided on at least one of the first or second side ofthe substrate, and a solder-resist layer provided on an outermost layerof the laminated structure, the solder resist layer having apertures ofdiffering sizes each exposing portions of the second conductor layer.The wiring board further includes a solder bump provided in each of theapertures, the solder bumps having substantially equal volumes but adifference in height no greater than 10 μm.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the invention and many of the attendantadvantages thereof will be readily obtained as the same becomes betterunderstood by reference to the following detailed description whenconsidered in connection with the accompanying drawings, wherein:

FIG. 1 shows views of a sequence of steps illustrating a method ofmanufacturing a multilayer printed wiring board according to anembodiment of the present invention.

FIG. 2 shows views of a sequence of steps illustrating a method ofmanufacturing a multilayer printed wiring board according to anembodiment of the present invention.

FIG. 3 shows views of a sequence of steps illustrating a method ofmanufacturing a multilayer printed wiring board according to anembodiment of the present invention.

FIG. 4 shows views of a sequence of steps illustrating a method ofmanufacturing a multilayer printed wiring board according to anembodiment of the present invention.

FIG. 5 shows views of a sequence of steps illustrating a method ofmanufacturing a multilayer printed wiring board according to anembodiment of the present invention.

FIG. 6 shows views of a sequence of steps illustrating a method ofmanufacturing a multilayer printed wiring board according to anembodiment of the present invention.

FIG. 7 shows views of a sequence of steps illustrating a method ofmanufacturing a multilayer printed wiring board according to anembodiment of the present invention.

FIG. 8 shows views of a sequence of steps illustrating a method ofmanufacturing a multilayer printed wiring board according to anembodiment of the present invention.

FIG. 9 is a cross-sectional view of a multilayered printed wiring boardrelated to an embodiment of the present invention.

FIG. 10 is a cross-sectional view of a multilayered printed wiring boardrelated to an embodiment of the present invention with a flat plateapplied to solder bumps.

FIG. 11 is a cross-sectional view of a multilayered printed wiring boardrelated to an embodiment of the present invention.

FIG. 12 is a cross-sectional view of a state in which an IC chip isplaced on the multilayered printed wiring board in FIG. 11.

FIG. 13 is a plan view of a multilayer printed wiring board related toan embodiment of the present invention.

FIG. 14A shows the framework of a device for mounting a solder ballrelated to the Embodiments of the present invention.

FIG. 14B shows the view from arrow B of the device for mounting a solderball in FIG. 14A according to an embodiment of the present invention.

FIG. 15 is a cross-sectional view of a multilayered printed wiring boardrelated to an embodiment of the present invention.

FIG. 16 is a cross-sectional view of a multilayered printed wiring boardrelated to an embodiment of the present invention.

FIG. 17A is an explanatory drawing illustrating solder bumps havingdifferent diameters according to background art.

FIG. 17B is an explanatory drawing illustrating solder bumps afterreflow according to background art.

DETAILED DESCRIPTION OF EMBODIMENTS

Because a small-diameter solder ball can become smaller than a sandgrain, for example, in the method for concomitantly using a mask foraligning a ball and a squeegee as in JP 2001-267731, the solder ball isdeformed by the squeegee and the height of the solder bump can vary,resulting in quality and reliability deterioration of the end device.For example, when a solder ball becomes smaller, the ratio of the weightto the surface area decreases and an attraction phenomenon occurs to thesolder ball due to the intermolecular force thereby causing the solderballs to easily stick or cling together. In the related art, becausesolder balls that stick or cling together come in contact with asqueegee, the solder balls are damaged and partially defected. If thesolder ball is partially defected, the volume of the solder bump becomesdifferent on each joint pad and the height of the solder bump varies asmentioned above. With high speed IC chips, there has been a demand forlarger diameters for the bumps constituting power supply lines andground lines so as to be capable of conducting large electricalcurrents, and, conversely, with highly integrated IC chips there hasbeen a demand for small diameters for the pads and bumps constitutingsignal lines. Accordingly, the present applicant conducted studies on aprovision for power supply and ground of large-diameter opening solderbumps 78P (solder volume being large) in large-diameter openings 71P andon a provision for signal line of small-diameter opening solder bumps71S (solder volume being small) in the small-diameter openings 71S inthe solder-resist layer 70, as illustrated in FIG. 17 (A). However, itwas learned that with the structure illustrated in FIG. 17 (A), thesolder constituting the small-diameter opening solder bump 78S flows outto the pad 92 side on the IC chip 90 when an IC chip is mounted, asillustrated in FIG. 17 (B), such that there occurs a disconnectionbetween the pad 92 on the IC chip and the pad 158 on the printed wiringboard.

One of the objectives for the present invention is to provide a printedwiring board and a method of manufacturing the printed wiring boardwhereby bumps can be formed in roughly the same height on the connectionpads (conductor circuits exposed out of the solder-resist layer andvarying in size) having varying opening diameters in the solder-resist.And another objective is to provide a printed wiring board and a methodof manufacturing the printed wiring board having a high mountabilityyield and connection reliability after the mounting.

One embodiment of the invention includes a method of manufacturing aprinted wiring board with solder bumps including at least the followingsteps (a) through (d):

(a) a step of forming a solder-resist layer having small-diameteropenings and large-diameter openings exposing connection pads;

(b) a step of loading, with the use of a mask provided with openingportions corresponding to the small-diameter openings and large-diameteropenings in the above-described solder-resist layer, metal balls havinga low melting point in said small-diameter openings and large-diameteropenings;

(c) a step of forming by reflow bumps having a high height out of themetal balls having a low melting point in the above-describedsmall-diameter openings and bumps having a low height out of the metalballs having a low melting point in the above-described large-diameteropenings; and

(d) a step of pressing from the top on the bumps having a high height inthe above-described small-diameter openings such that the height thereofis nearly the same as that of the bumps having a low height in theabove-described large-diameter openings.

According to another embodiment of the invention, a multilayer printedwiring board on a core substrate has through-hole conductors penetratingthe front face and the rear face, and there are alternately laminatedinterlayer resin insulating layers and conductor layers. Via-holeconductors connect a conductor layer to another conductor layer. Asolder-resist layer is provided on the outermost layer. A portion of theconductor layer is exposed from an opening in the solder-resist layer,constituting a pad to mount an electronic part, and solder bumps areformed on these pads.

The above-described openings have different apertures. Some havesmall-diameter apertures having a relatively small diameter and somehave large-diameter apertures having a relatively large diameter.

The solder bumps formed in said small-diameter apertures and the solderbumps formed in the above-described large-diameter apertures areadjusted such that they are approximated to each other in height by thesolder bumps formed in the above-described small-diameter apertures andin the above-described large-diameter apertures having the same volumeand by the solder bumps formed in the above-described small-diameterapertures by being flattened.

With the use of a mask, metal balls having a low melting point, ofsubstantially equal volume, are loaded into the large-diameter aperturesand the small-diameter apertures in the solder-resist layer. Bumpshaving a high height are formed out of metal balls having a low meltingpoint in the small-diameter apertures in the solder-resist layer andbumps having a low height are formed out of metal balls having a lowmelting point in the large-diameter apertures in the solder-resistlayer. Then, the bumps having a high height in the small-diameterapertures are pressed down from the top such that they are made nearlythe same in height as the bumps having a low height in thelarge-diameter apertures. Accordingly, even when solder-resist aperturediameters to expose connection pads vary, bumps can be formed in nearlythe same height. Since the bumps in the small-diameter apertures havethe same volume of the metal having a low melting point as the bumps inthe large-diameter apertures, the chance of non-connection at the bumpsin the small-diameter apertures when an IC chip is loaded via the bumpsin the small-diameter apertures and the bumps in the large-diameterapertures is reduced, increasing the connection reliability between theIC chip and the printed wiring board.

According to yet another embodiment, the metal balls having a lowmelting point are gathered with the use of a mask provided with apertureportions corresponding to the apertures in the solder-resist layer and acylinder member located above said mask. Air is sucked in from saidcylinder member, such that the metal balls are gathered directly belowthe cylinder member. By the above-described cylinder member or theprinted wiring board and the mask being moved relative to each other ina horizontal direction, the gathered metal balls are dropped into thesmall-diameter apertures and large-diameter apertures of thesolder-resist layer via the aperture portions of the mask. Accordingly,this enables fine metal balls having a low melting point to be loadedwith certainty and accuracy in all (or essentially all) the apertures ofthe solder-resist layer. Because the metal balls are moved without beingcontacted by a moving member such as a squeegee, the metal balls can beloaded in the small-diameter apertures and large-diameter apertureswithout being damaged and deformed, allowing the height of the resultingbumps to be uniform. Further, this enables metal balls having a lowmelting point to be properly placed in the apertures even on a printedwiring board with a largely irregular or undulated surface such as abuilt-up multilayer wiring board.

By flattening the solder bumps formed in the small-diameter apertures,the height of the solder bumps in the small-diameter apertures and theheight of the solder bumps in the large-diameter apertures areapproximately equal to each other even when the same volume metal ballsare used in different apertures. Thus, there occurs minimalnon-connection at the solder bumps in the small-diameter apertures whenan IC chip is loaded via the solder bumps in the small-diameterapertures and the solder bumps in the large-diameter apertures, allowingthe connection reliability between the IC chip and the printed wiringboard to be ensured.

According to yet another embodiment, pads for power supply and groundconnections are formed in large-diameter apertures and mainly disposedon the center area of the printed wiring board such that the length ofthe wiring is short resulting in lower resistance value so that thevoltage drop is minimized during a sudden increase in power consumptionto prevent the IC chip from malfunctioning. Further, because the solderbumps formed in the large diameter apertures are not flattened butmaintain in a semi-spherical shape, voids can easily be let out inreflow when the IC chip is loaded. Thus the resistance value of theconnection can be prevented from being elevated due to the formation ofvoids. Conversely, by forming pads for signal in small-diameterapertures, wiring density can be enhanced and concurrently by saidsmall-diameter apertures being mainly disposed on the outer area theprinted wiring board, where the large-diameter apertures are on thecenter area, the solder bumps in said small-diameter apertures areflattened with a flattening plate material having aperture portionscorresponding to the sites where the large-diameter apertures areformed, so that the large aperture bumps are not pressed by theflattening plate.

According to yet another embodiment, when solder-resist aperturediameters vary, by flattening the solder bumps formed in small-diameterapertures, the solder bumps in the small-diameter apertures and thesolder bumps in large-diameter apertures are approximated to the heightof 10 μm and have the same volume. Since the solder bumps in thesmall-diameter apertures are the same in volume with the solder bumps inlarge-diameter apertures, there occurs no non-connection at the solderbumps in small-diameter apertures when an IC chip is loaded via thesolder bumps in small-diameter apertures and the solder bumps inlarge-diameter apertures allowing the connection reliability between theIC chip and the printed wiring board to be ensured.

FIG. 14(A) shows the framework of a device for mounting a solder ballrelated to one example of the embodiments in the present invention, andFIG. 14 (B) shows the view from arrow B of the device for mounting asolder ball in FIG. 14 (A). For example, the device of FIGS. 14A and 14Bmay be used to mount a small solder ball 77 (less than 200 μm indiameter) on a joint pad of the multilayered printed wiring board.

A device for mounting a solder ball 100 comprises: a XYθ suction table114 that holds the positioning of a multilayered printed wiring board10, a vertically moving axis 112 that moves said XYθ suction table 114up and down, and a mask for aligning a ball 16, the mask comprising anaperture that corresponds to a joint pad of the multilayered printedwiring board. Also included is a mount cylinder (cylindrical member) 124that guides a solder ball moving on the mask for aligning a ball 16, asuction box 126 that provides negative pressure on the mount cylinder124, a cylinder for removing absorbed balls 161 to collect redundantsolder balls, and a suction box 166 that provides negative pressure onsaid cylinder for removing absorbed balls 161. Also included is asuction device for removing absorbed balls 168 that holds the collectedsolder balls, a mask clamp 144 that clamps the mask for aligning a ball16; and a moving axis in the X direction 140 that sends the mountcylinder 124 and the cylinder for removing absorbed balls 161 in an Xdirection. In one embodiment, the clamp 144 may be fixed to the table114 such that the mask moves with the table when the table is movable.Further included in the embodiment of FIGS. 1A and 1B is a support guidefor the moving axis 142 that supports the moving axis in an X direction140, an alignment camera 146 that images a multilayered printed wiringboard 10, a sensor for detecting remaining quantity 118 that detects theremaining quantity of solder balls under the mount cylinder 124, and afeeding device for solder balls 122 that feeds solder balls to the mountcylinder 124 according to the remaining quantity detected by the sensorfor detecting remaining quantity 118.

Next, with reference to FIG. 1 to FIG. 13, the constitution of themultilayered printing wiring board 10 related to embodiments of thepresent invention is explained. FIG. 11 illustrates a sectional view ofsaid multilayer printed wiring board 10, and FIG. 12 the condition inwhich the multilayer printed wiring board illustrated in FIG. 11 has anIC chip 90 attached thereto, which is placed on a daughter board 94.FIG. 13 illustrates a plan view of the multilayer printed wiring board10 prior to an IC chip being attached. FIG. 11 and FIG. 12 showillustratively with the numbers of solder bumps 78P and solder bumps 78s illustrated in FIG. 13 being reduced. In addition, on an actualpackage substrate hundreds of solder bumps 78P and solder bumps 78S areprovided.

As shown in FIG. 11, with respect to the multilayer printed wiring board10, conductive circuits 34 are formed on the surfaces of a coresubstrate 30. The top face and the bottom face of the core substrate 30are connected via through holes 36. On the core substrate 30 areprovided interlayer resin insulating layers 50, having via holes 60 andconductor circuits 58 formed thereon, and interlayer resin insulatinglayers 150, having via holes 160 and conductor circuits 158 formedthereon. On said via holes 160 and conductor circuits 158 are formedsolder-resist layers 70. In the solder-resist layers 70 are formedlarge-diameter (D1=105 μm in diameter) apertures 71P and small-diameter(D2=80 μm in diameter) apertures 71S, and there are provided solderbumps 78P for power supply and ground on pads 73P in the large-diameterapertures 71P and solder bumps 78S for signal on pads 73S in thesmall-diameter apertures 71S. The solder bumps for power supply andground 78P and the solder bumps for signal 78S are constituted out ofsolder balls having the same volumetric displacement as described below,such that they have the same volume. The height H1 of the large-diametersolder bumps 78P is set to about 30 μm and the height H2 of thesmall-diameter solder bumps 78S is set by being flattened to about 30μm, which is the same as the height of the large-diameter solder bumps78P. Many of the large-diameter solder bumps for power supply and ground78P are disposed closer toward the center of the multilayer printedwiring board, such that the wiring distance would be short, and thesmall-diameter solder bumps for signal 78S are disposed relativelylopsidedly on the outer side of the large-diameter solder bumps 78P. Onthe lower face side of the multilayer printed wiring board are formedsolder bumps 78D via the apertures of said solder-resist layer 70. Inaddition, while in FIG. 11 the apertures in the solder-resist are formedsuch that a portion of the conductor circuits 158 is exposed, theapertures may be formed such that they include only via holes 160 or viaholes 160 and a portion of the conductor circuits 158.

As shown in FIG. 12, the solder bumps for power supply and ground 78P onthe upper face side of the multilayer printed wiring board 10 areconnected to the electrodes for power supply and ground 92P of an ICchip 90 and the small-diameter aperture solder bumps 78S to theelectrodes for signal 92S. On the other hand, the solder bumps 78D onthe lower side are connected to the lands 96 of the daughter board 94.

As shown in FIG. 13, a plan view of the multilayer printed wiring boardprior to an IC chip being mounted, the multilayer printed wiring board10 has pads for power supply and ground 78P formed in large-diameterapertures 71P and mainly disposed on the center area (the area insidethe dotted lines PL) of the multilayer printed wiring board 10. This waythe length of the wiring from the IC chip 90 to the daughter board 94 isshort and the resistance is reduced. Thus, a drop in supply voltage isminimized when there is a sudden increase in consumed power by the ICchip to prevent the IC chip 90 from malfunctioning. Conversely, wiringdensity is increased by pads for signal 78S disposed inside the areaindicated by the broken lines SL being formed in the small-diameterapertures 71S.

With highly integrated IC chips, there has been a demand for theapertures in the solder-resist for the signal line of the packagesubstrate to be smaller in diameter and narrower in pitch. Conversely,in order to be able to handle a sudden increase in power consumption bythe IC chip, an extremely small diameter of the solder bumps for powersupply and ground on the package substrate is not desired. Namely, asmall diameter of the solder bumps made of a solder alloy leads to ahigh resistance value causing a voltage drop when there is a suddenincrease in power consumption causing the IC chip to malfunction. Asolution to satisfy this mutually conflicting requirement is for thesolder-resist apertures for signal to be of a small diameter and for thesolder bumps for power supply and ground to be of a large diameter.

Continuously, with reference to FIG. 1 through FIG. 6, the method ofmanufacturing the aforementioned multilayer printed wiring board 10,that was mentioned above with reference to FIG. 11, is explained.

A copper-foil laminated board 30A, wherein a copper foil being 5 to 250μm is laminated on both faces of an insulation substrate made of aglass-epoxy resin or a BT (bismaleimide triazine) resin 0.2 to 0.8 mm inthickness, was used as a starting material (FIG. 1 (A)). First, thiscopper-clad laminated board was drilled to bore through holes 33 (FIG. 1(B)), which was electroless-plated and electroplated to form side-wallconductor layers 36 b of the through holes 36 (FIG. 1 (C)).

(2) Next, the substrate 30 having through holes 36 formed therein iswashed with water and dried. Then the substrate 30 undergoes a blackingprocess with an aqueous solution containing NaOH (10 g/l), NaClO₂ (40g/l), and Na₃PO₄ (6 g/l) as a blacking bath (an oxidation bath) and areduction process with an aqueous solution containing NaOH (10 g/l) andNaBH4 (6 g/l) as a reduction bath to form roughened faces 36α on theside-wall conductor layers 36 b of the through holes 36 and the surfaces(FIG. 1 (D)).

(3) Next, the through holes 36 are filled with a filler 37 containingcopper particles of the average particle diameter being 10 μm (forexample, a non-conductive plugging copper paste made by Tatsuta ElectricWire & Cable Co., Ltd., Product Name: DD PASTE) with screen printing,which is dried and hardened (FIG. 2 (A)). This is performed such that acoating is given with a printing method on the substrate with a maskplaced thereon and provided with apertures at the through hole portionsto be filled in the through holes, and following the filling it is driedand hardened.

Continuing on, the filler 37 which oozed out of the through holes 36 isremoved by belt-sanding with the use of a #600 belt sanding paper (forexample, sanding paper made by Sankyo Rikagaku Co., Ltd.), and furtherbuffed to remove the flaws due to this belt-sanding to level thesurfaces of substrate 30 (FIG. 2 (B)). In this manner, a substrate 30 inwhich the side wall conductor layers 36 b of the through holes 36 andthe resin filler 37 are effectively attached through the roughenedlayers 36α is obtained.

(4) A palladium catalyst is added to the surfaces of the substrate 30leveled under the above-described step (3) which is electrolesscopper-plated to form electroless copper-plated films 23 of 0.6 μm inthickness (refer to FIG. 2 (C)).

(5) Then, an electrolytic copper plating is conducted under thefollowing conditions to form electrolytic copper plated films 24 of 15μm in thickness such that an added thickness for the portions toconstitute conductor circuits 34 and the portions to constitute thecover plated layers (through-hole lands) covering the filler 37 filledin through holes 36 are formed (FIG. 2 (D)).

The aqueous solution for electrolytic plating includes:

-   -   Sulfuric acid=180 g/l    -   Copper sulfate=80 g/l    -   Additive (made by Atotec Japan, Product name: Caparacid GL)=1        ml/l

Conditions for electrolytic plating include:

-   -   Current density=1 A/dm²    -   Time=70 minutes    -   Temperature=Room temperature.

(6) On both faces of the substrate 30 with the portions to constituteconductor circuits and cover plated layers formed thereon, acommercially available photosensitive dry film is attached, a mask isplaced, which is exposed at 100 mJ/cm² and developed with 0.8% sodiumcarbonate to form etching resists 25 of 15 μm in thickness (refer toFIG. 2 (E)).

(7) And, the plated films 23, 24 and the copper foils 32 at the portionswhere the etching resist 25 are not formed are dissolved and removedwith an etching solution having cupric chloride as the main ingredientthereof, and, further, the etching resists 25 are stripped and removedwith 5% KOH to form independent conductor circuits 34 and the coverplated layers 36 a covering the filler 37 (refer to FIG. 3 (A)).

(8) Next, on the surfaces of the cover plated layer 36 a covering theconductor circuits 34 and the filler 37 there a roughened layer (anuneven layer) 34β of 2.5 μm in thickness made of a Cu—Ni—P alloy isformed, and further, on the surface of this roughened layer 34β there anSn layer of 0.3 μm in thickness is formed (refer to FIG. 3 (B), except,the Sn layer is not shown).

(9) On both faces of the substrate there is formed an interlayer resininsulating layer 50, after a resin film for interlayer resin insulatinglayer (for example, manufactured by Ajinomoto Co., Inc., Product Name:ABF-45SH) 50γ being slightly larger than the substrate being placed onthe substrate and preliminarily pressure-bonded under the conditions ofthe pressure being 0.45 MPa, the temperature being 80° C., and thepressure-bonding time being 10 seconds and sheared, by being laminatedwith the use of a vacuum laminator by the following method (FIG. 3 (C)).Namely, the resin film for interlayer resin insulating layer is fullypressure-bonded under the conditions of the degree of vacuum being 67Pa, the pressure being 0.47 MPa, the temperature being 85° C., and thepressure-bonding time being 60 seconds and subsequently thermoset at170° C. for 40 minutes.

(10) Next, apertures for via holes 51 are formed in the interlayer resininsulating layers 50 with a CO₂ gas laser at the wavelength of 10.4 μmunder the conditions of the beam diameter of 4.00 mm, a top hat mode,the pulse width of 3 to 30 μm, and 1 to 3 shots (FIG. 3 (D)).

(11) The substrate with the apertures 51 for via holes is immersed in asolution containing 60 g/l permanganic acid at 80° C. for 10 minutes toremove particles present on the surfaces of the interlayer resininsulating layers 50, such that roughened faces 50 are formed on thesurfaces of the interlayer resin insulating layers 50 inclusive of theinner walls of the apertures for via holes 51 (FIG. 4 (A)).

(12) Next, the above-treated substrate is immersed in a neutralizingsolution (for example, manufactured by Shipley Company, LLC) and thenwashed with water. Further, to the surfaces of said substrate which havebeen roughened (roughening depth being 3 μm) a palladium catalyst isadded such that the catalyst nucleus is adhered to the surfaces of theinterlayer resin insulating layers and the inner wall surfaces of theapertures for via holes. Namely, the above-described substrate isimmersed in a catalyst solution containing palladium chloride (PbCl₂)and stannous chloride (SnCl₂) to allow palladium metal to precipitateand provide the catalyst.

(13) Next, the substrate provided with the catalyst is immersed in anelectroless copper plating aqueous solution (for example, Thru-cup PEAmanufactured by Uyemura Industries Co. Ltd.) to form an electrolesscopper plated film of 0.3 to 3.0 μm in thickness over the entireroughened surfaces, to obtain a substrate wherein electroless copperplated films are formed on the surfaces of the interlayer resininsulating layers 50, inclusive of the inner walls of the apertures forvia holes 51 (FIG. 4 (B)). Conditions for electroless plating are 34° C.solution temperature for 45 minutes.

(14) Commercially available photosensitive dry films are attached to thesubstrate on which electroless copper plated films 52 had been formedand a mask was placed, which was exposed at 110 mJ/cm² and developedwith 0.8% sodium carbonate aqueous solution to provide plating resists54 of 25 μm in thickness. Then, the substrate is washed with water at50° C. to remove grease, and then it is washed with water at 25° C. andfurther washed with sulfuric acid and subsequently it is electroplatedunder the following conditions to form electrolytic copper plated film56 of 15 μm in thickness on the portions where the plating resists 54had not been formed (FIG. 4 (C)).

Electrolytic plating solution includes:

Sulfuric acid 2.24 mol/l Copper sulfate 0.26 mol/l Additive 19.5 mol/l(for example, manufactured by Atotech Japan, Product Name: Caparacid GL)

Electrolytic plating conditions include:

Current density 1 A/dm² Time 70 minutes Temperature 22 ± 2° C.

(15) Further, after the plating resists 54 have been stripped andremoved with 5% KOH, the electroless plating films below the platingresists are dissolved and removed by an etching process with a mixturesolution of sulfuric acid and hydrogen peroxide to constituteindependent conductor circuits 58 and via holes 60 (FIG. 4 (D)).

(16) Then, the similar processing as in the above-described (4) isconducted to from roughened faces 58α on the surfaces of the conductorcircuits 58 and via holes 60. The thickness of the lower layer conductorcircuit 58 is 15 μm (FIG. 5 (A)). The lower layer conductor circuit maybe formed as having the thickness over the range of 5 to 25 μm.

(17) By repeating the above-mentioned steps (9) through (16), aninterlayer insulating layer 150 having upper layer conductor circuits158 and via holes 160 is further formed to obtain a multilayer wiringboard (FIG. 5 (B)).

(18) Next, a commercially available solder-resist (or solder-mask)composition 70 is coated in a thickness of 20 μm on both faces of themultilayer wiring substrate, and then it is dried for 20 minutes at 70°C. and then for 30 minutes at 70° C. Then, a photo mask of 5 mmthickness on which a pattern of the aperture portion of thesolder-resist is drawn is tightly adhered to the solder-resist layer 70,after the solder-resist layer 70 was exposed to an ultraviolet ray of1,000 mJ/cm² and developed with a DMTG solution to form large-diameter(D1=105 μm) apertures 71P and small-diameter (D2=80 μm) apertures 71S onthe upper face side, and apertures 71 of 200 μm in diameter on the lowerface side, and large-diameter pads 73P formed by a portion of theconductor circuits 158 exposed in the large-diameter apertures 71P andthe small-diameter pads 73S formed by a portion of the conductorcircuits 158 exposed in the small-diameter apertures 71S (FIG. 5 (C)).

Further, the solder-resist layers are hardened by heat processes underthe conditions of for one hour at 80° C., for one hour at 100° C., forone hour at 120° C., and for three hours at 150° C. to formsolder-resist pattern layers of 15 to 25 μm in thickness havingapertures.

(19) Next, the substrate on which solder-resist layers 70 is formed isimmersed in an electroless nickel plating solution at pH=4.5 andcontaining nickel chloride (2.3×10⁻¹ mol/l), sodium hypophosphite(2.8×10⁻¹ mol/l), and sodium citrate (1.6×10⁻¹ mol/l) for 20 minutes toform nickel plated layer 72 of about 5 μm in thickness in the apertureareas 71, 71S, and 71P. Furthermore, the substrate is immersed in anelectroless gold plating solution containing potassium gold cyanide(7.6×10⁻³ mol/l), ammonium chloride (1.9×10⁻¹ mol/l), sodium citrate(1.2×10⁻¹ mol/l), and sodium hypophosphite (1.7×10⁻¹ mol/l) under theconditions of for 7.5 minutes at 80° C. to form a gold plated layer 74of about 0.03 μm in thickness on the nickel plated layer 72 (FIG. 5(D)). Besides a nickel-gold layer, a single layer of tin or a preciousmetal (gold, silver, palladium, platinum, etc.) may be formed. Further,a conductive pad may be formed without adding metal layers.

(20) A process to mount a solder ball.

Continuing on, a process of loading solder balls onto the multilayerprinted wiring board 10 with the solder ball loading apparatus 100described above with reference to FIG. 14 will be described withreference to FIG. 6 through FIG. 8.

(I) Position Recognition and Correction of the Multilayer Printed WiringBoard.

The alignment mark 34M of the multilayer printed wiring board 10 isrecognized with the alignment camera 146, as illustrated in FIG. 6 (A),such that the position of the multilayer printed wiring board 10 withrespect to the ball arrangement mask 16 is corrected with the XYθsuction table 114. In other words, the position is adjusted such thateach of the apertures 16 a of the ball arrangement mask 16 correspondsto each of the small-diameter apertures 71S and the large-diameterapertures 71P of the multilayer printed wiring board 10.

(II) Feeding of Solder Balls.

As shown in FIG. 6 (B), the solder balls 77 (75 μm in diameter, Sn63Pb37(for example, manufactured by Hitachi Metals, Ltd.)) are supplied in aspecified quantity from the solder ball supply unit 122 to the side of aplurality of loading cylinders 124. In addition, they may in advance besupplied to be stored in a loading cylinder. While Sn/Pb solder ballsare used for solder balls in this example, Pb-free solder balls selectedfrom a group of Sn and Ag, Cu, In, Bi, Zn, etc. can be used.

(III) Loading of Solder Balls.

The loading cylinders 124 are positioned above the ball arrangement mask16 while maintaining a predetermined clearance (for example, 0.5 to 4times the ball diameter) to the ball arrangement mask, as illustrated inFIG. 7 (A), and air is suctioned from the suction portion 124 b suchthat the flow velocity at the gap between the loading cylinder and theprinted wiring board is set to 5 m/sec to 35 m/sec to allow the solderballs 77 to gather on the ball arrangement mask 16 directly below theaperture portion 124A of said loading cylinder 124.

Subsequently, the loading cylinders 124 lined up along the Y axis of themultilayer wiring board 10 as illustrated in FIG. 7 (B) and FIG. 8 (A)as well as FIG. 14 (B) and FIG. 14 (A) are moved in a horizontaldirection along the X axis via the X-direction moving shaft 140. Thiscauses the solder balls 77 gathered on the ball arrangement mask 16 tobe moved with the movement of the loading cylinders 124, such that theyare dropped via the apertures 16 a of the ball arrangement mask 16 andloaded into the small-diameter apertures 71S and the large-diameterapertures 71P of the multilayer printed wiring board 10. The solderballs 77 are successively arranged on all the connection pads on theside of the multilayer printed wiring board 10.

While the loading cylinders 124 are moved, it is possible, instead, tomove the multilayer printed wiring board 10 and the ball arrangementmask 16 with the loading cylinders 124 held stationary such that thesolder balls 77 gathered directly below the loading cylinders 124 areloaded into the small-diameter apertures 71S and the large-diameterapertures 71P of the multilayer printed wiring board 10 via theapertures 16 a of the ball arrangement mask 16.

(IV) Removal of Excess Solder Balls.

As illustrated in FIG. 8 (B), the excess solder balls 77 are guided bythe loading cylinders 124 to the locations where there are no apertures16 a on the ball arrangement mask 16 to suction out and remove them withthe ball removal cylinder 161.

(21) Then, the solder balls 77 on the upper face are melted by reflow at230° C. to form large-diameter aperture solder bumps 78P having a lowheight (H1≈30 μm, the height protruding out of the surface of thesolder-resist) out of the solder balls 77 in the large-diameterapertures 71P, and small-diameter aperture solder bumps 78S having ahigh height (H3≈40 μm, the height protruding out of the surface of thesolder-resist) out of the solder balls 77 in the small-diameterapertures 71S and solder bumps 78D on the lower face (FIG. 9).

(22) Then, as shown in FIG. 10, the solder bumps having a high height78S in the small-diameter apertures 71S are flattened by a flat plate 80having an aperture 80A at the position corresponding to thelarge-diameter aperture solder bump portion being pressed on such thatit is brought to the same height (H2≈30 μm) as the height (H1≈30 μm) ofthe solder bumps 78P in the large-diameter apertures 71P (FIG. 11). Theflat plate 80 may be heated.

In accordance with an embodiment of the invention, the solder bumps insmall-diameter apertures 71S, being disposed mainly on the outer side ofthe large-diameter apertures 71P, which are on the center side, areflattened with the flat plate 80 having an aperture 80A corresponding tothe positions at which the large-diameter apertures 71P are disposed.This results in solder bumps 78S in the small-diameter apertures 71Shaving the approximate height of the solder bumps 78P in thelarge-diameter apertures 71P with the same volume.

Thus the IC chip 90 is loaded onto the multilayer printed wiring board10, and by reflow the connections pads of the printed wiring board andthe electrodes of the IC chip are connected via the solder bumps 78P and78S. At that juncture, since the solder amount of the solder bumps 78Sin the small-diameter apertures 71S is the same as that of the solderbumps 78P in the large-diameter apertures 71P, no non-connection occursat the solder bumps 78S in the small-diameter apertures 71S, allowingthe connection reliability between the IC chip 90 and the multilayerprinted wiring board 10 to be ensured. Subsequently, the multilayerprinted wiring board 10 is attached to a daughter board 94 via solderbumps 78D (FIG. 12).

In accordance with an embodiment of the invention, by the solder bumpshaving a high height 78S in the small-diameter apertures 71S beingflattened, the solder bumps 78S will result in solder bumps formedroughly at the same height as solder bumps 78P formed in large-diameterapertures 71P, even if the small aperture diameter varies. Thus, themounting yield of the IC chip can be enhanced and an improvement of theconnection reliability between the IC chip 90 and the multilayer printedwiring board 10 becomes possible.

Further, in accordance an embodiment of the invention, because thesolder bumps for power supply and ground 78P in the large-diameterapertures 71P are not flattened and maintain a semi-spherical shape,voids are easily let out during reflow when the IC chip is loaded,preventing the occurrence of voids due to air inside the solder bumps.This prevents high resistance connections, and is highly advantageousfor a power supply connection.

According to an embodiment of the invention, with the loading cylinders124 positioned above the ball arrangement mask 16, the solder balls 77are gathered directly below the loading cylinders 124 by air beingsuctioned out of said loading cylinders 124. The solder balls 77 aremoved over the ball arrangement mask 16 by the movement of the loadingcylinders 124, or by the movement of the ball arrangement mask 16 whilethe loading cylinders 124 are held still. The solder balls 77 aredropped into the small-diameter apertures 71S and the large-diameterapertures 71P of the multilayer printed wiring board 10 via theapertures 16 a of the ball arrangement mask 16. This allows withcertainty fine solder balls 77 to be loaded into all of thesmall-diameter apertures 71S and large-diameter apertures 71P of themultilayer printed wiring board 10. And, since the solder balls aremoved without touching a mechanical movement part such as a squeegee,the solder balls can be loaded into the small-diameter apertures 71S andlarge-diameter apertures 71P without being damaged or deformed,resulting in an even height of the solder bumps 78S and 78P, unlike thecase where a squeegee is used. Further, since the solder balls areguided by suction force, the aggregation and adhesion of solder ballscan be prevented. Since they present themselves as solder bumps of alarge volume having a uniform height, they present themselves as, notonly having a high cold and heat shock resistance, but also having lowresistance solder bumps which are advantageous for power supply.

In accordance an embodiment of the invention, the height ofsmall-diameter solder bumps 78S and the height of the large-diametersolder bumps 78P are set to the same 30 μm. It becomes difficult toensure no non-connection bumps if the difference in height is greaterthan 10 μm.

Continuing on, a multilayer printed wiring board and a method ofmanufacturing the multilayer printed wiring board pertaining to anotherembodiment of the present invention will be described with reference toFIG. 15 and FIG. 16.

As described above with reference to FIG. 10 and FIG. 11, only thesmall-diameter solder bumps having a high height 78S were flattened. Inaccordance with another embodiment of the invention, as illustrated inFIG. 15, the large-diameter solder bumps having a low height 78P arealso flattened. The large-diameter solder bumps formed in thelarge-diameter (D1=105 μm) apertures 71P and the small-diameter solderbumps 78S having a high height formed in the small-diameter (D2=80 μm)apertures 71S are pressed with the flat plate 80. The solder bumps 78Shaving a high height in the small-diameter apertures 71S and the solderbumps 78P in the large-diameter apertures 71P are flattened such thatthe heights (H2≈30 μm) are the same (FIG. 11). In addition, the solderbumps 78S and the solder bumps 78P are formed out of solder balls havingthe same diameter and have the same volume.

As shown in FIG. 16, the solder bumps 78S in the small-diameterapertures 71S are flattened as a whole and the large-diameter solderbumps 78P are flattened at the top only. In accordance to thisembodiment, the height of all the solder bumps can advantageously be setuniformly to a desired height.

1. A method of manufacturing a printed wiring board having bumps,comprising: forming a solder-resist layer having a small-diameteraperture and a large-diameter aperture, each aperture exposing arespective conductive pad of the printed wiring board; loading a solderball in each of the small-diameter aperture and the large-diameteraperture using a mask having aperture areas that correspond to thesmall-diameter aperture and the large-diameter aperture of saidsolder-resist layer; forming a first bump, having a first height, fromsaid solder ball in the small-diameter aperture; forming a second bump,having a second height, from said solder ball in the large-diameteraperture, the first height being greater than the second height; andpressing a top of the first bump in the small-diameter aperture suchthat the first height of the first bump becomes substantially the sameas the second height of the second bump.
 2. The method according toclaim 1, wherein the loading comprises: positioning a cylinder memberhaving an aperture area that faces an upper side of the mask; gatheringmultiple solder balls on the mask immediately below the cylinder memberby inrushing air to the aperture area of the cylinder member; andloading one of the gathered solder balls in each of the small-diameteraperture and the large-diameter aperture in the solder-resist layerthrough the aperture areas of the mask by moving the cylinder memberrelative to the mask.
 3. The method according to claim 2, furthercomprising: removing redundant solder balls, that are not aligned in anaperture area of the mask, from the mask by suction.
 4. The methodaccording to claim 1, further comprising applying a flux to the smalldiameter aperture before loading a solder ball therein.
 5. The methodaccording to claim 4, wherein the loading comprises: positioning acylinder member having an aperture area that faces an upper side of themask; gathering multiple solder balls on the mask immediately below thecylinder member by inrushing air to the aperture area of the cylindermember; and loading one of the gathered solder balls in thesmall-diameter aperture and the large-diameter aperture in thesolder-resist layer through the aperture areas of the mask by moving thecylinder member relative to the mask.
 6. The method according to claim1, further comprising: applying a flux to the large diameter aperturebefore mounting the metal ball therein.
 7. The method according to claim6, wherein the loading comprises: positioning a cylinder member havingan aperture area that faces an upper side of the mask; gatheringmultiple solder balls on the mask immediately below the cylinder memberby inrushing air to the aperture area of the cylinder member; andloading one of the gathered solder balls in the small-diameter apertureand the large-diameter aperture in the solder-resist layer through theaperture areas of the mask by moving the cylinder member relative to themask.
 8. The method according to claim 1, further comprising: removingredundant metal balls, that are not aligned in an aperture, from themask by suction.
 9. The method according to claim 1, further comprising:pressing a top of the second bump in the large-diameter aperture suchthat the height of the second bump in the large-diameter aperture is ata desirable level.
 10. The method according to claim 1, wherein thepressing is performed by a flat plate that is heated.
 11. The methodaccording to claim 1, wherein the second height is approximately 30 μm.12. The method according to claim 1, wherein the forming comprisesforming a large-diameter aperture that is approximately 105 μm.
 13. Themethod according to claim 1, wherein the forming comprises forming asmall-diameter aperture that is approximately 80 μm.
 14. The methodaccording to claim 1, wherein the bump in the large-diameter aperture ispositioned in a center region of the printed wiring board.
 15. Themethod according to claim 1, wherein the bump in the small-diameteraperture is positioned in a periphery region of the printed wiringboard.
 16. A multilayer printed wiring board comprising: a substratehaving a first side and a second side opposing the first side; alaminated structure including alternately laminated interlayer resininsulating layers and conductor layers, the laminated structure beingprovided on at least one of the first or second side of the substrate; asolder-resist layer provided on an outermost layer of the laminatedstructure, the solder resist layer having apertures of differing sizeseach exposing portions of the second conductor layer; and a solder bumpprovided in each of said apertures, the solder bumps havingsubstantially equal volumes but a difference in height no greater than10 μm.
 17. The multilayer printed wiring board according to claim 16,wherein said apertures of differing sizes include apertures having afirst diameter and apertures having a second diameter, the firstdiameter being smaller than the second diameter.
 18. The multilayerprinted wiring board according to claim 17, wherein the apertures havingthe second diameter are disposed in a center area of the printed wiringboard, and the apertures having the first diameter are disposed on aperipheral area of the printed wiring board.
 19. The multilayer printedwiring board according to claim 16, wherein the solder bumps areapproximately of the same height.
 20. The multilayer printed wiringboard according to claim 17, wherein the solder bumps formed in theapertures having the first diameter are flattened to be substantiallyequal in height to bumps formed in the apertures having the seconddiameter.
 21. The multilayer printed wiring board according to claim 17,wherein bumps formed in the apertures having the second diameter aresemi-spherical in shape.
 22. The method according to claim 1, whereinthe loading comprises: positioning a cylinder member having an aperturearea that faces an upper side of the mask; gathering multiple solderballs on the mask immediately below the cylinder member by inrushing airto the aperture area of the cylinder member; and loading one of thegathered solder balls in the small-diameter aperture and thelarge-diameter aperture in the solder-resist layer through the apertureareas of the mask by moving the mask and the printed wiring boardrelative to the cylinder member.